... non-pressure cure ==> 无压硫化 non-pressure head ==> 前盖 non-pressure process ==> 常压法 ...
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non-pressure head gasket 前盖垫
The pressure differential generates a lift force that supports the wafer below the head portion (54) of the wand in a substantially non-contacting manner, employing the Bernoulli principle.
该压力差生成以基本非接触的方式支撑该棒的 头部部分（54）下面的晶片的抬升力，其采用了伯努利定理。
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